DocumentCode :
2102995
Title :
Influence of bulk wave excitation on performance of impedance elements SAW filters realised on 36/spl deg/ and 42/spl deg/-LiTaO/sub 3/ substrates
Author :
Kondratiev, S.N. ; Thorvaldsson, T.
Author_Institution :
Temex-SAW, Neuchatel, Switzerland
Volume :
1
fYear :
1999
fDate :
17-20 Oct. 1999
Firstpage :
317
Abstract :
This paper presents new results of the influence of bulk wave excitation on the performance of impedance elements (IE) SAW filters in the 200-950 MHz frequency range realized on 36° and 42°-LiTaO3 substrates. It was found experimentally, for devices using metal film thickness to wavelength ratio h/λ in the range of 5%-8%, that bulk wave activity on 42°-LiTaO3 substrate is essentially less than that for the 36°-LiTaO3 substrate. Another result of this paper is that the amplitude ripple, rejection and the insertion loss in the bandwidth of IE filters realized on 36° and 42°-LiTaO3 substrates depend on the roughness of the wafer backside, type of glue and thickness of metal film. Three different filters are presented: a low loss filter in the 900 MHz range with 4% relative bandwidth and a measured insertion loss of less than 0.5 dB, a filter at about 450 MHz with 2% relative bandwidth and more than 50 dB level of rejection and finally a filter in the 200 MHz range with a relative bandwidth of about 4% and an insertion loss of 0.7 dB.
Keywords :
lithium compounds; surface acoustic wave filters; 200 to 950 MHz; LiTaO3; LiTaO3 substrates; amplitude ripple; backside roughness; bulk wave excitation; impedance elements SAW filters; insertion loss; Acoustic waves; Admittance measurement; Attenuation measurement; Bandwidth; Frequency measurement; Impedance; Insertion loss; SAW filters; Substrates; Surface acoustic waves;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics Symposium, 1999. Proceedings. 1999 IEEE
Conference_Location :
Caesars Tahoe, NV
ISSN :
1051-0117
Print_ISBN :
0-7803-5722-1
Type :
conf
DOI :
10.1109/ULTSYM.1999.849410
Filename :
849410
Link To Document :
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