• DocumentCode
    2103158
  • Title

    Subsurface Imaging of Integrated Circuits with Widefield and Confocal Microscopy Using Numerical Aperture Increasing Lens

  • Author

    Köklü, F. Hakan ; Vamivakas, A.N. ; Quesnel, J.I. ; Ippolito, S.B. ; Goldberg, B.B. ; Ünlü, M.S.

  • Author_Institution
    Boston Univ., Boston
  • fYear
    2007
  • fDate
    21-25 Oct. 2007
  • Firstpage
    535
  • Lastpage
    536
  • Abstract
    We report a lateral spatial resolution of 0.37 mum with a custom infrared widefield microscope while imaging subsurface features in silicon integrated circuits from backside. In addition, 2.65 mum apart polysilicon and metal layers can be differentiated.
  • Keywords
    elemental semiconductors; monolithic integrated circuits; optical microscopy; silicon; Subsurface Imaging; confocal microscopy; infrared widefield microscope; lens; metal layers; numerical aperture; silicon integrated circuits; spatial resolution; Apertures; Cellular neural networks; Focusing; Image resolution; Infrared imaging; Lenses; Nails; Optical fibers; Optical imaging; Optical microscopy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Lasers and Electro-Optics Society, 2007. LEOS 2007. The 20th Annual Meeting of the IEEE
  • Conference_Location
    Lake Buena Vista, FL
  • ISSN
    1092-8081
  • Print_ISBN
    978-1-4244-0925-9
  • Electronic_ISBN
    1092-8081
  • Type

    conf

  • DOI
    10.1109/LEOS.2007.4382516
  • Filename
    4382516
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2103158