• DocumentCode
    2103515
  • Title

    A novel bitmap analysis technique - test sensitivity intensity bitmap

  • Author

    Gim, Chan Hum

  • Author_Institution
    Motorola Malaysia Sdn Bhd, Selangor, Malaysia
  • fYear
    2002
  • fDate
    2002
  • Firstpage
    105
  • Lastpage
    109
  • Abstract
    Bitmapping is a common tool used for analysis and device characterisation on volatile and non-volatile memory in integrated circuits. The tester normally provides the electrical failing address and the analyst will use a scramble table to convert the electrical failing address to the physical failing address. A software may be used to descramble the electrical failing addresses and then display the physical location of the failure using simple graphics. In this paper, a novel bitmap technique is presented. Instead of just displaying the X,Y physical location of the failure, which is basically two dimensions, this bitmap technique takes it a step further. The new bitmap technique ´test sensitivity intensity (TSI) bitmap´ is a graphical combination of all the listed tools. The idea of using a graphical bitmap was to make it easier to visualise the failure and the pattern of the failure as test conditions change from relaxed conditions to very stringent conditions, compared to a simple data dump memory display.
  • Keywords
    automatic testing; bit-mapped graphics; failure analysis; integrated circuit testing; integrated memory circuits; bitmap analysis technique; device characterisation; electrical failing address; integrated circuits; nonvolatile memory; physical failing address; physical location; scramble table; test conditions; test sensitivity intensity; test sensitivity intensity bitmap; volatile memory; Circuit testing; Displays; Electricity supply industry; Failure analysis; Graphics; Hardware; Nonvolatile memory; Power supplies; Topology; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits, 2002. IPFA 2002. Proceedings of the 9th International Symposium on the
  • Print_ISBN
    0-7803-7416-9
  • Type

    conf

  • DOI
    10.1109/IPFA.2002.1025626
  • Filename
    1025626