DocumentCode :
2103571
Title :
Isothermal em as highly accelerated test method for copper damascene lines
Author :
Kin Leong ; Yap Andrew ; Bee Hoon Lim ; Eng Chye Chua ; Yeow Kheng Lim ; Suat Cheng ; Khoo Sherry
Author_Institution :
Chartered Semiconductor Manufacturing
fYear :
2002
fDate :
12-12 July 2002
Firstpage :
129
Lastpage :
134
Keywords :
Circuit testing; Copper; Electromigration; Integrated circuit interconnections; Isothermal processes; Life estimation; Packaging; Semiconductor device testing; Temperature; Thermal stresses;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2002. IPFA 2002. Proceedings of the 9th International Symposium on the
Conference_Location :
Singapore
Print_ISBN :
0-7803-7416-9
Type :
conf
DOI :
10.1109/IPFA.2002.1025631
Filename :
1025631
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2103571
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