DocumentCode
2103998
Title
Low-noise CMOS analog-to-digital interface for MEMS resistive microphone
Author
Nebhen, J. ; Savary, Eric ; Rahajandraibe, W. ; Dufaza, C. ; Meillere, Stephane ; Haddad, F. ; Kussener, Edith ; Barthelemy, Herve ; Czarny, J. ; Walther, Andrea
Author_Institution
IM2NP, Aix-Marseille Univ., Marseille, France
fYear
2013
fDate
8-11 Dec. 2013
Firstpage
445
Lastpage
448
Abstract
The design and implementation of a CMOS integrated analog to digital interface dedicated to hybrid integration of MEMS resistive microphone is presented. Audio sensing is achieved with an innovative low-cost technology that uses single crystal piezoresistive silicon nanowires as transducer in a MEMS. The circuit composed of a low-noise instrumentation preamplifier followed by a single bit fourth order continuous-time sigma-delta modulator (CT-ΣΔM) includes bias circuit for sensor. To join low power applications where extensive digital processing is employed, 0.28 μm CMOS process with a 2.5 V supply has been adopted. The test chip occupies an area of 1 mm2. Post-layout simulation exhibits promising performances where noise density is below 8 nV/VHz within the frequency range from 10 Hz to 10 kHz. Complete interface circuit features a current consumption of 2.4 mA.
Keywords
CMOS integrated circuits; micromechanical devices; microphones; nanowires; piezoresistive devices; preamplifiers; sigma-delta modulation; CMOS process; MEMS resistive microphone; audio sensing; bias circuit; current 2.4 mA; frequency 10 Hz to 10 kHz; low noise CMOS analog to digital interface; low noise instrumentation preamplifier; single bit fourth order continuous time sigma delta modulator; single crystal piezoresistive silicon nanowires; size 0.28 mum; voltage 2.5 V; Bridge circuits; CMOS integrated circuits; Micromechanical devices; Microphones; Modulation; Noise; Silicon; Audio systems; CMOS integrated circuits; MEMS; Microphone;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics, Circuits, and Systems (ICECS), 2013 IEEE 20th International Conference on
Conference_Location
Abu Dhabi
Type
conf
DOI
10.1109/ICECS.2013.6815450
Filename
6815450
Link To Document