Title :
A 1.6Gb/s/pair electromagnetically coupled multidrop bus using modulated signaling
Author :
Simon, T. ; Amirtharajah, R. ; Benham, J.R. ; Critchlow, J.L. ; Knight, T.F., Jr.
Abstract :
AC coupling and pulse modulation are presented for high speed multidrop busses. A prototype eight module memory bus operates at a 400MHz symbol rate with 4 bits of modulated data per symbol, for 1.6Gb/s/pair. Test chips in 0.25/spl mu/m 3M CMOS dissipate 40mW peak and occupy 340/spl times/200/spl mu/m per pair.
Keywords :
CMOS digital integrated circuits; electromagnetic coupling; jitter; pulse modulation; 0.25 micron; 1.6 Gbit/s; 40 mW; 400 MHz; AC coupling; CMOS; electromagnetically coupled multidrop bus; modulated signaling; pulse modulation; symbol rate; Circuit testing; Clocks; Coupling circuits; Electromagnetic coupling; Geometry; Impedance; Intersymbol interference; Sockets; Space vector pulse width modulation; System testing;
Conference_Titel :
Solid-State Circuits Conference, 2003. Digest of Technical Papers. ISSCC. 2003 IEEE International
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-7707-9
DOI :
10.1109/ISSCC.2003.1234259
