DocumentCode
2105664
Title
A 1.6Gb/s/pair electromagnetically coupled multidrop bus using modulated signaling
Author
Simon, T. ; Amirtharajah, R. ; Benham, J.R. ; Critchlow, J.L. ; Knight, T.F., Jr.
fYear
2003
fDate
13-13 Feb. 2003
Firstpage
184
Abstract
AC coupling and pulse modulation are presented for high speed multidrop busses. A prototype eight module memory bus operates at a 400MHz symbol rate with 4 bits of modulated data per symbol, for 1.6Gb/s/pair. Test chips in 0.25/spl mu/m 3M CMOS dissipate 40mW peak and occupy 340/spl times/200/spl mu/m per pair.
Keywords
CMOS digital integrated circuits; electromagnetic coupling; jitter; pulse modulation; 0.25 micron; 1.6 Gbit/s; 40 mW; 400 MHz; AC coupling; CMOS; electromagnetically coupled multidrop bus; modulated signaling; pulse modulation; symbol rate; Circuit testing; Clocks; Coupling circuits; Electromagnetic coupling; Geometry; Impedance; Intersymbol interference; Sockets; Space vector pulse width modulation; System testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Circuits Conference, 2003. Digest of Technical Papers. ISSCC. 2003 IEEE International
Conference_Location
San Francisco, CA, USA
ISSN
0193-6530
Print_ISBN
0-7803-7707-9
Type
conf
DOI
10.1109/ISSCC.2003.1234259
Filename
1234259
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