Characterization of a flip-chip interconnect at frequencies up to 30 GHz

Author

Szymanowski, Margaret ; Safavi-Naeini, S.

Author_Institution

Dept. of Electr. & Comput. Eng., Waterloo Univ., Ont., Canada

Volume

2

fYear

2000

fDate

2000

Firstpage

784

Abstract

In this paper, a coplanar-waveguide on the mother board connected by a bump with another coplanar-waveguide on the chip is analyzed in the range of frequencies between 1 GHz and 30 GHz. Various package-schemes of a flip-chip are presented and analyzed. The variations include the length of the overlap of the cpw on the mother-board and the cpw on the chip. It is concluded that the overlap of the coplanar waveguides is one of the most important parameters which determine the characteristics of the bump-connection. Based on the S-parameters, the important physical parameters of the bump-connections are analyzed and recommendations are made concerning the bump connection. The S-parameters are used in order to calculate the Y-parameters, from which the circuit model is obtained. The parameters of the circuit model are calculated and demonstrated for frequencies between 1 GHz and 30 GHz. The results presented in this paper are obtained by a method of moment

Keywords

coplanar waveguides; equivalent circuits; flip-chip devices; integrated circuit interconnections; 1 to 30 GHz; S-parameters; Y-parameters; bump-connection; circuit model; coplanar-waveguide; flip-chip interconnect characterisation; package-schemes; Conducting materials; Coplanar waveguides; Electromagnetic waveguides; Finite difference methods; Frequency; Integrated circuit interconnections; Moment methods; Packaging; Scattering parameters; Time domain analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical and Computer Engineering, 2000 Canadian Conference on

Conference_Location

Halifax, NS

ISSN

0840-7789

Print_ISBN

0-7803-5957-7

Type

conf

DOI

10.1109/CCECE.2000.849572

Filename

849572