Title :
Reduction of current density at disk electrode periphery by shaping current pulse edges
Author :
Boshuo Wang ; Weiland, James D.
Author_Institution :
Biomed. Eng. Dept., Univ. of Southern California, Los Angeles, CA, USA
fDate :
Aug. 28 2012-Sept. 1 2012
Abstract :
Previous studies reveal that the primary distribution of the current density is sharply enhanced at the edge of a disk electrode submerged into a semi-infinite space of conductive solution. The current enhancement will cause the double layer capacitance at the periphery of the electrode to be charged much faster compared to the center, and can also lead to severe corrosion at the edge. While several studies focused on the geometric design of the electrode to reduce this enhancement, we explore the feasibility of achieving similar effect by shaping the edges of the current input. The simulation uses finite element analysis software to solve the system of partial differential equations and results show that the edge enhancement could be greatly reduced without significantly changing the input efficacy of current and/or charge.
Keywords :
biomedical electrodes; corrosion; current density; finite element analysis; partial differential equations; conductive solution semiinfinite space; corrosion; current density primary distribution; current density reduction; current enhancement; disk electrode periphery; double layer capacitance; electrode geometric design; geometric design; input efficacy; partial differential equations; shaping current pulse edges; Capacitance; Current density; Electric potential; Electrodes; Immune system; Mathematical model; Steady-state; Neural prosthesis; electrical stimulation; implantable devices; microelectrode; neural engineering; Animals; Computer Simulation; Computer-Aided Design; Electric Stimulation; Electrodes, Implanted; Energy Transfer; Equipment Design; Equipment Failure Analysis; Humans; Models, Neurological; Neurons;
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2012 Annual International Conference of the IEEE
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-4119-8
Electronic_ISBN :
1557-170X
DOI :
10.1109/EMBC.2012.6347150