• DocumentCode
    2107117
  • Title

    Heat flux-based sensor for the measurement of the power dissipated by switching devices

  • Author

    Iero, D. ; Della Corte, Francesco G. ; Fiorentino, G. ; Sarro, P.M. ; Morana, B.

  • Author_Institution
    Dipt. di Ing. dell´Inf., delle Infrastrutt. e dell´Energia Sostenibile (DIIES), Univ. Mediterranea di Reggio Calabria, Reggio Calabria, Italy
  • fYear
    2013
  • fDate
    25-27 Sept. 2013
  • Firstpage
    19
  • Lastpage
    23
  • Abstract
    The precise measurement of the power dissipated by a semiconductor device operating in fast dynamic conditions is an important issue in power conversion circuits to evaluate their overall efficiency. Measurement errors can be introduced in particular by the probes or by instruments that are transparent to high dv/dt and di/dt rates. For this reason, the use of bulky and expensive set-up´s is often required. We present a simple method based on a micromachined dual-sensor heat-flux measurement device, coupled to a readout circuit, that allows the estimation by calorimetry of the dissipated power. By means of a controlled Peltier heat pump, the switching device is held at room temperature in order to minimise the heat exchanged with the ambient and improve therefore the precision of the measurement. The sensor could be in principle integrated within the switching device case itself, to allow the lifelong monitoring of the produced heat.
  • Keywords
    calorimeters; calorimetry; semiconductor switches; calorimetry; controlled Peltier heat pump; heat flux-based sensor; lifelong monitoring; micromachined dual-sensor heat-flux measurement device; power dissipation measurement; switching devices; Current measurement; Frequency measurement; Heating; Loss measurement; Power measurement; Temperature measurement; Temperature sensors; calorimetric methods; heat-flux sensors; loss measurement; power losses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Applied Measurements for Power Systems (AMPS), 2013 IEEE International Workshop on
  • Conference_Location
    Aachen
  • Print_ISBN
    978-1-4673-5571-1
  • Type

    conf

  • DOI
    10.1109/AMPS.2013.6656219
  • Filename
    6656219