Title :
On-chip interconnect for mm-wave applications using an all-copper technology and wavelength reduction
Author :
Cheung, T.S.D. ; Long, J.R. ; Vaed, K. ; Volant, R. ; Chinthakindi, A. ; Schnabel, C.M. ; Florkey, J. ; Stein, K.
Author_Institution :
Toronto Univ., Ont., Canada
Abstract :
Transmission lines are implemented using an all-copper backend developed for RF and microwave applications. Wavelength reduction is used to achieve a Q factor >20 from 20GHz to 40GHz, about three times higher than conventional transmission lines implemented with the same technology. It has 0.3dB/mm loss, and reduces the wavelength of a conventional transmission line by half thereby minimizing the space for on-chip microwave devices.
Keywords :
MIMIC; Q-factor; copper; high-frequency transmission lines; integrated circuit interconnections; 20 to 40 GHz; Cu; MM-wave integrated circuit; Q-factor; all-copper technology; on-chip interconnect; transmission line; wavelength reduction; Attenuation; Conductors; Coplanar waveguides; Copper; Dielectric substrates; Frequency; Integrated circuit interconnections; Semiconductivity; Silicon; Strips;
Conference_Titel :
Solid-State Circuits Conference, 2003. Digest of Technical Papers. ISSCC. 2003 IEEE International
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-7707-9
DOI :
10.1109/ISSCC.2003.1234353
