Pb-free microelectronics assembly in aerospace applications

Author

Shapiro, Andrew A. ; Bonner, J.K. ; Ogunseitan, Oladele A. ; Shphores, J.-D.M. ; Schoenung, Julie M.

Author_Institution

Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA

Volume

4

fYear

2004

fDate

13-13 March 2004

Firstpage

2474

Abstract

The commercial microelectronics industry is rapidly implementing Pb-free assembly strategy. This trend is driven by existing and proposed legislation in Europe and Japan, which has already led a number of firms (including AT&T, IBM, Motorola, HP and Intel) to adopt Pb-free implementation programs. This is another sign that the microelectronics industry has become truly global. Following Moore´s law, progress in microelectronics is brisk but not uniform: in many cases, commercial industry is ahead of the aerospace sector in technology. Progress by commercial industry, along with cost, drives the use of Commercial Off-The-Shelf (COTS) parts for military and space applications. We can thus anticipate that the aerospace industry, would be forced to use Pb-free components and subsystems as part of their standard business practices.

Keywords

integrated circuit manufacture; microassembling; space vehicle electronics; IBM; Moore law; Pb free microelectronics assembly; SnAgCu; SnAgCuSb; SnInAg; aerospace applications; aerospace industry; commercial off-the-shelf parts; legislation; microelectronics industry; military applications; Aerospace industry; Assembly; Business; Costs; Defense industry; Europe; Legislation; Microelectronics; Moore´s Law; Space technology;

fLanguage

English

Publisher

ieee

Conference_Titel

Aerospace Conference, 2004. Proceedings. 2004 IEEE

Conference_Location

Big Sky, MT

ISSN

1095-323X

Print_ISBN

0-7803-8155-6

Type

conf

DOI

10.1109/AERO.2004.1368042

Filename

1368042