DocumentCode
2109557
Title
A New Method For Simulation Of Etching And Deposition Processes
Author
Strasser, E. ; Wimmer, K. ; Selberherr, S.
Author_Institution
Technical University of Vienna
fYear
1993
fDate
14-15 May 1993
Firstpage
54
Lastpage
55
Keywords
Algebra; Anisotropic magnetoresistance; Etching; Geometry; Microelectronics; Morphological operations; Semiconductor device modeling; Spatial filters; Surface morphology; Surface topography;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Process and Device Modeling, 1993. (1993 VPAD) 1993 International Workshop on
Print_ISBN
0-7803-1338-0
Type
conf
DOI
10.1109/VPAD.1993.724720
Filename
724720
Link To Document