Finite element analysis for BEOL stress engineering to improve yield and reliability of sub-30 nm structures

Author

Kaulfersch, Eberhard ; Bramer, B. ; Rzepka, S. ; Breuer, Dirk ; Clauss, Ellen ; Feustel, Frank

Author_Institution

Micro Mater. Center, Fraunhofer ENAS, Chemnitz, Germany

fYear

2013

fDate

26-27 Sept. 2013

Firstpage

1

Lastpage

4

Abstract

Deformation of trenches due to residual stresses in TiN may result in Cu voids forming especially at shrinking feature sizes of trenches and vias and introducing low-k dielectrics between Cu interconnects. The influence of residual stress therefore has been investigated in a parametric study using Finite Element analyses (FEA) to discover the correlation between the TiN stresses and failure occurrence at various geometric representations. FEA has been shown to allow effective BEoL (Back end of line) stress engineering leading to improved yield and reliability of next generation interconnect systems in minimum development time.

Keywords

copper; deformation; finite element analysis; interconnections; internal stresses; low-k dielectric thin films; reliability; titanium compounds; vias; voids (solid); BEOL stress engineering; Cu; FEA; TiN; back end of line stress engineering; failure occurrence; finite element analysis; low-k dielectrics; next generation interconnect systems; residual stresses; structure reliability; trench deformation; Compressive stress; Deformable models; Finite element analysis; Residual stresses; Strain; Tin; (FEA) Finite Element analyses; DoE; TiN hard mask; residual stress; wiggling;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Conference Dresden-Grenoble (ISCDG), 2013 International

Conference_Location

Dresden

Print_ISBN

978-1-4799-1250-6

Type

conf

DOI

10.1109/ISCDG.2013.6656314

Filename

6656314