• DocumentCode
    2109785
  • Title

    A Non-Uniform Grid Based Ground Plane Model for High Performance Nodes: The Impact of Heterogeneous Cores on Ground Voltage Gradient

  • Author

    Venkateswaran, N. ; Mukundrajan, Ravindhiran ; Sharma, Mrigank ; Ravi, Badrinarayanan

  • Author_Institution
    Waran Res. Found., Chennai
  • fYear
    2009
  • fDate
    13-15 May 2009
  • Firstpage
    49
  • Lastpage
    54
  • Abstract
    With shift towards heterogeneous core architectures imminent, the uniform grid based ground plane model that is currently employed for chip-multiprocessors will no longer suffice. It is practically impossible to achieve absolute zero potential at all grid nodes of the uniform ground plane model with advent of heterogeneous cores. Differential injection of current into the ground plane by different heterogeneous core partitions results in voltage gradients across the ground plane, which is detrimental to the operation of the processor. The extremely stochastic spiking activity of different cores further accentuates the problem. To overcome the problem of varying voltage distribution across the ground plane, we propose a first-ever ground plane model structured as a non-uniform RLC interconnect grid. A simulated annealing optimization is employed with parameter of dasiatemperaturepsila as each node in the grid and impedance as the cost function psiladeltaepsila to arrive at the non-uniform grid structure.
  • Keywords
    microprocessor chips; simulated annealing; ground plane model; ground voltage gradient; heterogeneous core architectures; multiprocessor chip; nonuniform RLC interconnect grid; simulated annealing optimization; voltage distribution; Collision mitigation; Computer Society; High definition video; Very large scale integration; Voltage; Ground Bounce Elimination; Ground Plane; Non-Uniform Grid Ground Plane;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI, 2009. ISVLSI '09. IEEE Computer Society Annual Symposium on
  • Conference_Location
    Tampa, FL
  • Print_ISBN
    978-1-4244-4408-3
  • Electronic_ISBN
    978-0-7695-3684-2
  • Type

    conf

  • DOI
    10.1109/ISVLSI.2009.52
  • Filename
    5076382