DocumentCode :
2109868
Title :
High-Speed Low-Current Duobinary Signaling Over Active Terminated Chip-to-Chip Interconnect
Author :
Rao, P. Vijaya Sankara ; Mandal, Pradip ; Sachdev, Sunil
Author_Institution :
Dept of E & ECE, Indian Inst. of Technol., Kharagpur
fYear :
2009
fDate :
13-15 May 2009
Firstpage :
73
Lastpage :
78
Abstract :
In this work we propose high-speed low-current duobinary signaling scheme over an active terminated chip-to-chip interconnect. The active termination scheme eliminates the need of any dedicated passive terminator both at the transmitter and receiver, avoiding signal reflection. Elimination of the passive terminator helps to reduce the transmitted signal level without effecting signal detect-ability of the receiver and also removes the thermal noise of the terminator. To implement bandwidth efficient duobinary signaling, we present a current-mode high-speed precoder operating at 10-Gb/s. A low-current active terminated driver based on modified Cherry-Hooper topology is proposed. At the receive-end, we propose an active terminated current-mode receiver(Rx) with regulated gate cascode (RGC) based transimpedance amplifier(TIA). Folded active inductor peaking is used to enhance the bandwidth of this TIA. We also propose low-power broadband equalizer topology for channel equalization. The duobinary transmitter and receiver circuits are implemented in 1.8-V, 0.18-mum Digital CMOS technology with an fT of 27-GHz. The designed high speed duobinary Tx/Rx circuits work up-to 8-Gb/s speed while transmitting the data over FR4 PCB trace of length 29.5-inch and for the targeted bit-error-rate(BER) of 10-12. The power consumed in the transmitter and receiver circuits is 42.9-mW at 8-Gb/s.
Keywords :
amplifiers; current-mode circuits; integrated circuit interconnections; signal detection; thermal noise; active terminated chip-to-chip interconnect; current-mode receiver; folded active inductor peaking; high-speed low-current duobinary signaling; regulated gate cascode; signal detectability; thermal noise; transimpedance amplifier; Acoustic reflection; Bandwidth; CMOS technology; Circuit topology; Driver circuits; Integrated circuit interconnections; Noise level; Noise reduction; Signal detection; Transmitters; active termination; chip-to-chip interconnect; duobinary;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI, 2009. ISVLSI '09. IEEE Computer Society Annual Symposium on
Conference_Location :
Tampa, FL
Print_ISBN :
978-1-4244-4408-3
Electronic_ISBN :
978-0-7695-3684-2
Type :
conf
DOI :
10.1109/ISVLSI.2009.9
Filename :
5076386
Link To Document :
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