• DocumentCode
    2109886
  • Title

    The fundamentals of designing deployable structures with elastic memory composites

  • Author

    Lake, Mark S. ; Campbell, Douglas

  • Author_Institution
    Composite Technol. Dev. Inc., Lafayette, CO, USA
  • Volume
    4
  • fYear
    2004
  • fDate
    13-13 March 2004
  • Firstpage
    2745
  • Abstract
    Elastic memory composite (EMC) materials exhibit many favorable qualities for deployable structures and have piqued a broad interest within America´s deployable space structures industry. EMC materials are similar to traditional fiber-reinforced composites except for the use of a thermoset shape memory resin that enables much higher packaging strains than traditional composites without damage to the fibers or the resin. This unique capability is being exploited in the development of very efficient EMC structural components for deployable spacecraft systems. The present paper is intended primarily to help deployable system designers develop a better understanding of the special capabilities of EMC materials, and the unique considerations that must be applied when engineering structural components with these materials. Specifically, the paper discusses: 1) the impacts of incorporating EMC materials on deployable system design, 2) analyses for packaging strain, deployment time, and deployment energy; and 3) requirements and concepts for heating systems.
  • Keywords
    aerospace engineering; aerospace industry; fibre reinforced composites; intelligent materials; packaging; resins; thermostats; deployable space structure system; deployable spacecraft system design; deployment energy; deployment time; elastic memory composite materials; engineering structural components; fiber-reinforced composites; heating system design; packaging strains; thermoset shape memory resin; Aerospace engineering; Aerospace industry; Aircraft manufacture; Capacitive sensors; Composite materials; Design engineering; Electromagnetic compatibility; Packaging; Resins; Shape;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Aerospace Conference, 2004. Proceedings. 2004 IEEE
  • Conference_Location
    Big Sky, MT
  • ISSN
    1095-323X
  • Print_ISBN
    0-7803-8155-6
  • Type

    conf

  • DOI
    10.1109/AERO.2004.1368072
  • Filename
    1368072