DocumentCode
2109886
Title
The fundamentals of designing deployable structures with elastic memory composites
Author
Lake, Mark S. ; Campbell, Douglas
Author_Institution
Composite Technol. Dev. Inc., Lafayette, CO, USA
Volume
4
fYear
2004
fDate
13-13 March 2004
Firstpage
2745
Abstract
Elastic memory composite (EMC) materials exhibit many favorable qualities for deployable structures and have piqued a broad interest within America´s deployable space structures industry. EMC materials are similar to traditional fiber-reinforced composites except for the use of a thermoset shape memory resin that enables much higher packaging strains than traditional composites without damage to the fibers or the resin. This unique capability is being exploited in the development of very efficient EMC structural components for deployable spacecraft systems. The present paper is intended primarily to help deployable system designers develop a better understanding of the special capabilities of EMC materials, and the unique considerations that must be applied when engineering structural components with these materials. Specifically, the paper discusses: 1) the impacts of incorporating EMC materials on deployable system design, 2) analyses for packaging strain, deployment time, and deployment energy; and 3) requirements and concepts for heating systems.
Keywords
aerospace engineering; aerospace industry; fibre reinforced composites; intelligent materials; packaging; resins; thermostats; deployable space structure system; deployable spacecraft system design; deployment energy; deployment time; elastic memory composite materials; engineering structural components; fiber-reinforced composites; heating system design; packaging strains; thermoset shape memory resin; Aerospace engineering; Aerospace industry; Aircraft manufacture; Capacitive sensors; Composite materials; Design engineering; Electromagnetic compatibility; Packaging; Resins; Shape;
fLanguage
English
Publisher
ieee
Conference_Titel
Aerospace Conference, 2004. Proceedings. 2004 IEEE
Conference_Location
Big Sky, MT
ISSN
1095-323X
Print_ISBN
0-7803-8155-6
Type
conf
DOI
10.1109/AERO.2004.1368072
Filename
1368072
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