DocumentCode :
2110068
Title :
Thermal Effects in Current Feedback Operational Amplifiers in Bipolar Technology
Author :
Sinha, Kamal R. ; Xie, Xuesong ; Carter, Ronald L. ; Davis, W. Alan ; Russell, Howard T.
Author_Institution :
Dept. of Electr. Eng., Univ. of Texas at Arlington, Arlington, TX
fYear :
2008
fDate :
17-20 April 2008
Firstpage :
1
Lastpage :
6
Abstract :
This paper presents an analysis of the of self-heating on the key performance parameters of the high speed current feedback operational amplifiers (CFOA) designed using SOI bipolar transistors. The analysis shows that the frequency response of the open-loop transimpedance and common-mode rejection ratio (CMRR) of the CFOA is highly affected by the dynamic self-heating induced errors. A large- signal step response of the CFOA in the closed-loop configuration, can have a large thermal tail due to the static self-heating effects. These thermal effects are studied using the conventional topology of the CFOA and different topologies of the CFOA are identified to mitigate such effects. The classical and optimized CFOA circuits are simulated to demonstrate the thermal effects using the vertical bipolar inter-company (VBIC) model in the SPECTRE simulator.
Keywords :
bipolar analogue integrated circuits; circuit simulation; feedback amplifiers; frequency response; operational amplifiers; silicon-on-insulator; thermal analysis; SOI bipolar transistors; SPECTRE simulator; Si-SiO2; bipolar technology; closed-loop configuration; common-mode rejection ratio; conventional CFOA topology; dynamic self-heating induced errors; frequency response; high speed current feedback operational amplifiers; open-loop transimpedance; optimized CFOA circuits; static self-heating effects; thermal effects; vertical bipolar inter-company model; Bipolar transistors; Circuit simulation; Circuit topology; Feedback; Mirrors; Operational amplifiers; Tail; Thermal conductivity; Thermal resistance; Voltage; CFOA; CMRR; bipolar transistor; current mirrors; thermal cutoff frequency; thermal resistance; thermal tail; transimpedance; voltage buffer;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Region 5 Conference, 2008 IEEE
Conference_Location :
Kansas City, MO
Print_ISBN :
978-1-4244-2076-6
Electronic_ISBN :
978-1-4244-2077-3
Type :
conf
DOI :
10.1109/TPSD.2008.4562734
Filename :
4562734
Link To Document :
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