• DocumentCode
    2110693
  • Title

    Analysis Of Mechanical Stress Associated With Trench Isolation Using A Two-dimensional Simulation

  • Author

    Matsuda, S. ; Itoh, N. ; Yoshino, C. ; Tsuboi, Y. ; Katsumata, Y. ; Iwat, H.

  • Author_Institution
    Toshiba Corporation
  • fYear
    1993
  • fDate
    14-15 May 1993
  • Firstpage
    64
  • Lastpage
    65
  • Keywords
    Analytical models; Electric variables; Laboratories; Leakage current; Silicon; Spectroscopy; Stress measurement; Temperature; Thermal stresses; Ultra large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Process and Device Modeling, 1993. (1993 VPAD) 1993 International Workshop on
  • Print_ISBN
    0-7803-1338-0
  • Type

    conf

  • DOI
    10.1109/VPAD.1993.724724
  • Filename
    724724
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2110693