Title :
How far can integration go for 3G cellphones?
Author :
Camp, W.O. ; Stetzler, Trudy
Author_Institution :
Sony Ericsson Mobile Communications
Abstract :
Presents a summary of evening session topics.
Conference_Titel :
Solid-State Circuits Conference, 2003. Digest of Technical Papers. ISSCC. 2003 IEEE International
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-7707-9
DOI :
10.1109/ISSCC.2003.1234778
