Title :
Thermomechanical reliability investigation of large temperature excursions in power electronics packages
Author :
Ning, Puqi ; Ngo, Khai ; Wang, Fred
Author_Institution :
Power Electron. & Electr. Power Syst. Res. Center, Oak Ridge Nat. Lab., Knoxville, TN, USA
Abstract :
This study confirms that high stresses between the metallization layer and ceramic lead to significant failures in DBC substrate. The driving forces behind several different failure modes are discussed. Further understanding of these failure mechanisms enables the modules to be engineered for longtime operation and helps to enhance the reliability of system-level operation.
Keywords :
electronics packaging; metallisation; power electronics; reliability; DBC substrate; large temperature excursions; metallization layer; power electronics packages; system-level operation; thermomechanical reliability; Aluminum oxide; Copper; Finite element methods; Reliability; Simulation; Stress; Substrates;
Conference_Titel :
Energy Conversion Congress and Exposition (ECCE), 2011 IEEE
Conference_Location :
Phoenix, AZ
Print_ISBN :
978-1-4577-0542-7
DOI :
10.1109/ECCE.2011.6063786
