DocumentCode
2111555
Title
Thermomechanical reliability investigation of large temperature excursions in power electronics packages
Author
Ning, Puqi ; Ngo, Khai ; Wang, Fred
Author_Institution
Power Electron. & Electr. Power Syst. Res. Center, Oak Ridge Nat. Lab., Knoxville, TN, USA
fYear
2011
fDate
17-22 Sept. 2011
Firstpage
319
Lastpage
324
Abstract
This study confirms that high stresses between the metallization layer and ceramic lead to significant failures in DBC substrate. The driving forces behind several different failure modes are discussed. Further understanding of these failure mechanisms enables the modules to be engineered for longtime operation and helps to enhance the reliability of system-level operation.
Keywords
electronics packaging; metallisation; power electronics; reliability; DBC substrate; large temperature excursions; metallization layer; power electronics packages; system-level operation; thermomechanical reliability; Aluminum oxide; Copper; Finite element methods; Reliability; Simulation; Stress; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Energy Conversion Congress and Exposition (ECCE), 2011 IEEE
Conference_Location
Phoenix, AZ
Print_ISBN
978-1-4577-0542-7
Type
conf
DOI
10.1109/ECCE.2011.6063786
Filename
6063786
Link To Document