Title :
On-chip CMOS coplanar transmission line measurements and model verification up to 50 GHz
Author :
Goren, D. ; Sheinman, B. ; Woods, W. ; Rascoe, J. ; Shlafman, S.
Author_Institution :
IBM Haifa Res. Labs., Haifa
Abstract :
The results show good agreement between de-embedded measurement and T- line coplanar model in both S-parameters and in Zo representation. In all cases the results of the T-line coplanar model are very close to the corresponding results of the EM solver. The RC model deviates significantly in the frequency domain from the T-line coplanar model results - both in S- parameters and in -Zo representation. The design impact of these deviations depends on the design niche (eg. digital vs. RF), and for a given design niche it may apply only to a given subset of critical wires (eg. clock line, high speed signal line etc.). The criticality of a given wire depends also on the wire length, and the on-chip effective bandwidth (rise time in digital or frequency in RF). For digital designs, the criteria for using a model that includes inductive effects (instead of RC model) was given and discussed previously.The considerations of designing the RF launching structures have been discussed. We have found that a robust optimal design of the RF launching structure allows for the usage of very simple de-embedding techniques up to relatively high frequencies.
Keywords :
CMOS integrated circuits; S-parameters; coplanar transmission lines; CMOS integrated circuit; RF launching structures; S-parameters; T-line coplanar model; coplanar transmission line; de-embedding techniques; digital designs; electromagnetic solver; inductive effects; model verification; Clocks; Coplanar transmission lines; Frequency domain analysis; RF signals; Radio frequency; Scattering parameters; Semiconductor device modeling; Signal design; Transmission line measurements; Wire;
Conference_Titel :
Microwaves, Communications, Antennas and Electronic Systems, 2008. COMCAS 2008. IEEE International Conference on
Conference_Location :
Tel-Aviv
Print_ISBN :
978-1-4244-2097-1
Electronic_ISBN :
978-1-4244-2098-8
DOI :
10.1109/COMCAS.2008.4562807