DocumentCode
2111674
Title
Challenges regarding parallel-connection of SiC JFETs
Author
Peftitsis, Dimosthenis ; Baburske, Roman ; Rabkowski, Jacek ; Lutz, Josef ; Tolstoy, Georg ; Nee, Hans-Peter
Author_Institution
Electr. Machines & Power Electron. Lab. (EME), R. Inst. of Technol. (KTH), Stockholm, Sweden
fYear
2011
fDate
May 30 2011-June 3 2011
Firstpage
1095
Lastpage
1101
Abstract
Considering the present development of the available Silicon Carbide switches, their current ratings are so low that they cannot be used for high-power converters. It is therefore necessary to connect several switches in parallel in order to obtain sufficient current ratings. An investigation of parallel-connected normally-on Silicon Carbide Junction Field Effect Transistors is presented in this paper. The parameters that play the most important role for the parallel connection are the pinch-off and the gate-source breakdown voltages. The temperature dependency of those two voltages is analyzed based on the pnp structure of the device. If the spread in these parameters is sufficiently large there might be no possibility for a stable off-state operation of a pair of transistors without forcing one of the gate voltages to exceed the breakdown voltage, especially at high temperatures. A solution to this problem is given. The switching performance of two pairs of parallel-connected devices is compared with respect to their pinch-off voltages, and it is found that differences of approximately 25% in switching losses could result from a difference in the pinch-off voltage of 0.5 V.
Keywords
junction gate field effect transistors; power semiconductor switches; silicon compounds; wide band gap semiconductors; JFET; SiC; gate-source breakdown voltage; parallel-connection; pinch-off; voltage 0.5 V; Breakdown voltage; Capacitance; JFETs; Logic gates; Silicon carbide; Switching loss; Temperature; Junction Field Effect Transistor; Parallel-Connected Switches; Silicon Carbide;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Electronics and ECCE Asia (ICPE & ECCE), 2011 IEEE 8th International Conference on
Conference_Location
Jeju
ISSN
2150-6078
Print_ISBN
978-1-61284-958-4
Electronic_ISBN
2150-6078
Type
conf
DOI
10.1109/ICPE.2011.5944660
Filename
5944660
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