• DocumentCode
    2112147
  • Title

    Miniaturized telemetry antennas with integrated electronics

  • Author

    Goodwin, Thomas

  • Author_Institution
    Tyco Electron., Lowell, MA
  • fYear
    2008
  • fDate
    13-14 May 2008
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Microstrip wrap antennas have been used for telemetry applications since the 1960´s. Robert Munson published a seminal paper describing wrap antenna theory and design in 1974. The basic antenna concept consists of a continuous radiating element and a corporate feed network printed on a thin dielectric substrate, which is then formed to be conformal to a cylindrical or conical surface. Typically, a radome layer is added to provide environmental protection. The theory of operation is well understood and has been adequately described in numerous publications. Wrap antenna´s main benefits include low cost, lightweight, conformability and reliability; their main disadvantage is relatively narrow bandwidth. With recent development of formable, high-dielectric constant materials, it has become feasible to design wrap antennas for smaller diameter applications. In addition, advances in miniaturization of electronics have enabled the integration of active electronics to these types of antennas. This paper discusses the design challenges presented by small diameters, and innovative designs for antennas with integrated electronics developed to meet these challenges.
  • Keywords
    antenna feeds; antenna radiation patterns; microstrip antennas; radiotelemetry; active electronics; continuous radiating element; corporate feed network; environmental protection; integrated electronics; microstrip wrap antenna; miniaturized telemetry antenna; radome layer; thin dielectric substrate; Antenna feeds; Antenna theory; Bandwidth; Dielectric substrates; Equations; High-K gate dielectrics; Microstrip antennas; Protection; Stress; Telemetry;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwaves, Communications, Antennas and Electronic Systems, 2008. COMCAS 2008. IEEE International Conference on
  • Conference_Location
    Tel-Aviv
  • Print_ISBN
    978-1-4244-2097-1
  • Electronic_ISBN
    978-1-4244-2098-8
  • Type

    conf

  • DOI
    10.1109/COMCAS.2008.4562829
  • Filename
    4562829