Title :
WiMax system-in-package solutions based on LTCC- technology
Author :
Heyen, J. ; Yatsenko, A. ; Nalezinski, M. ; Sevskiy, G. ; Heide, P.
Author_Institution :
EPCOS AG, Product Dev. Modules, Munich
Abstract :
This paper presents a highly integrated WiMax system-in-package (SiP) based on LTCC technology (low temperature co-fired ceramics). It comprises the complete passive and active RF frontend plus the transceiver RFIC for up- and down-conversion to base band. The overall size of such a smart package strongly depends on the applied technology and level of integration (multiband/multimode). The benefits on size reduction coming from advanced integration and assembly technologies are discussed and a very compact LTCC SiP with less than 50 mm2 size and SMT-compatible footprint is demonstrated. Top level measurements show full performance and thus fully validate the LTCC integration approach.
Keywords :
WiMax; ceramic packaging; system-in-package; transceivers; LTCC; WiMax system-in-package; assembly technology; low temperature co-fired ceramics; transceiver; Assembly; Band pass filters; Insertion loss; Integrated circuit interconnections; Packaging; Radio frequency; Radiofrequency integrated circuits; Surface-mount technology; Switches; WiMAX;
Conference_Titel :
Microwaves, Communications, Antennas and Electronic Systems, 2008. COMCAS 2008. IEEE International Conference on
Conference_Location :
Tel-Aviv
Print_ISBN :
978-1-4244-2097-1
Electronic_ISBN :
978-1-4244-2098-8
DOI :
10.1109/COMCAS.2008.4562839
