WiMax system-in-package solutions based on LTCC- technology

Author

Heyen, J. ; Yatsenko, A. ; Nalezinski, M. ; Sevskiy, G. ; Heide, P.

Author_Institution

EPCOS AG, Product Dev. Modules, Munich

fYear

2008

fDate

13-14 May 2008

Firstpage

1

Lastpage

6

Abstract

This paper presents a highly integrated WiMax system-in-package (SiP) based on LTCC technology (low temperature co-fired ceramics). It comprises the complete passive and active RF frontend plus the transceiver RFIC for up- and down-conversion to base band. The overall size of such a smart package strongly depends on the applied technology and level of integration (multiband/multimode). The benefits on size reduction coming from advanced integration and assembly technologies are discussed and a very compact LTCC SiP with less than 50 mm² size and SMT-compatible footprint is demonstrated. Top level measurements show full performance and thus fully validate the LTCC integration approach.

Keywords

WiMax; ceramic packaging; system-in-package; transceivers; LTCC; WiMax system-in-package; assembly technology; low temperature co-fired ceramics; transceiver; Assembly; Band pass filters; Insertion loss; Integrated circuit interconnections; Packaging; Radio frequency; Radiofrequency integrated circuits; Surface-mount technology; Switches; WiMAX;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwaves, Communications, Antennas and Electronic Systems, 2008. COMCAS 2008. IEEE International Conference on

Conference_Location

Tel-Aviv

Print_ISBN

978-1-4244-2097-1

Electronic_ISBN

978-1-4244-2098-8

Type

conf

DOI

10.1109/COMCAS.2008.4562839

Filename

4562839