DocumentCode
2112548
Title
Stretchable biocompatible electronics by embedding electrical circuitry in biocompatible elastomers
Author
Jahanshahi, A. ; Salvo, Pietro ; Vanfleteren, Jan
Author_Institution
Centre for Microsyst. Technol. (CMST), IMEC-Ghent Univ., Ghent, Belgium
fYear
2012
fDate
Aug. 28 2012-Sept. 1 2012
Firstpage
6007
Lastpage
6010
Abstract
Stretchable and curvilinear electronics has been used recently for the fabrication of micro systems interacting with the human body. The applications range from different kinds of implantable sensors inside the body to conformable electrodes and artificial skins. One of the key parameters in biocompatible stretchable electronics is the fabrication of reliable electrical interconnects. Although very recent literature has reported on the reliability of stretchable interconnects by cyclic loading, work still needs to be done on the integration of electrical circuitry composed of rigid components and stretchable interconnects in a biological environment. In this work, the feasibility of a developed technology to fabricate simple electrical circuits with meander shaped stretchable interconnects is presented. Stretchable interconnects are 200nm thin Au layer supported with polyimide (PI). A stretchable array of light emitting diodes (LEDs) is embedded in biocompatible elastomer using this technology platform and it features a 50% total elongation.
Keywords
biomedical equipment; biomedical materials; elastomers; integrated circuit interconnections; light emitting diodes; biocompatible elastomer; electrical circuitry; electrical interconnects; elongation; gold layer; light emitting diode; polyimide; skin; stretchable biocompatible electronics; stretchable interconnect; Arrays; Fabrication; Gold; Integrated circuit interconnections; Light emitting diodes; Reliability; Sensors; Biocompatible Materials; Electronics; Microscopy; Microscopy, Electron, Scanning;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society (EMBC), 2012 Annual International Conference of the IEEE
Conference_Location
San Diego, CA
ISSN
1557-170X
Print_ISBN
978-1-4244-4119-8
Electronic_ISBN
1557-170X
Type
conf
DOI
10.1109/EMBC.2012.6347363
Filename
6347363
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