DocumentCode :
2112960
Title :
Manufacturability and sustainability analysis of nano-scale manufacturing
Author :
Yuan, Chris Y. ; Dornfeld, David
Author_Institution :
Dept. of Mech. Eng., Univ. of California, Berkeley, CA
fYear :
2008
fDate :
19-22 May 2008
Firstpage :
1
Lastpage :
1
Abstract :
In this project, atomic layer deposition (ALD) of Al2O3 high-k dielectric films on silicon wafers is studied as a model process of nanotechnology. The ALD process uses trimethyl aluminum as the metal source and water as the oxidant.
Keywords :
aluminium compounds; atomic layer deposition; high-k dielectric thin films; nanotechnology; Al2O3; atomic layer deposition; high-k dielectric films; manufacturability analysis; nanoscale manufacturing; nanotechnology; silicon wafers; sustainability analysis; trimethyl aluminum; Aluminum oxide; Atomic layer deposition; High-K gate dielectrics; Manufacturing; Mechanical engineering; Merging; Performance analysis; Thickness control; USA Councils; Water;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics and the Environment, 2008. ISEE 2008. IEEE International Symposium on
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4244-2272-2
Electronic_ISBN :
978-1-4244-2298-2
Type :
conf
DOI :
10.1109/ISEE.2008.4562860
Filename :
4562860
Link To Document :
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