• DocumentCode
    2113027
  • Title

    Simultaneous disassembly of PCBs based on components reusability assessment

  • Author

    Jiping, Yang ; Dong, Xiang ; Peng, Gao ; Yang, Cheng ; Guanghong, Duan

  • Author_Institution
    Dept. of Precision Instrum. & Mechanology, Tsinghua Univ., Beijing
  • fYear
    2008
  • fDate
    19-22 May 2008
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    Disassembly is the first issue in the recycling of obsolete printed circuit boards (PCBs). Although high automation and robotics have been achieved in the industrial assembly of PCBs, the dismantlement of PCBs still keeps a low level of manual operation with simple tools, except some pilot or demonstration projects realized in research institutes. Consumption market of electrical and electronic equipments is very flourishing in China, which causes millions of used PCBs abandoned every year. Manual disassembly of PCBs is the most common method in China now. In order to improve the disassembly efficiency and evaluate the disassembled components, as well as to ameliorate working conditions and minimize the environmental pollution, it is necessary to develop a PCB disassembly and component reusability assessment system which is commercially feasible to industrial application. Under the support of National Key Technologies R&D Program of China, we quested for technological solutions for PCB disassembly and component assessment to catch up the demand of sustainable development.
  • Keywords
    printed circuits; sustainable development; PCB; components reusability assessment; electronic equipments; industrial assembly; printed circuit boards; reusability assessment system; simultaneous disassembly; sustainable development; Electrical equipment industry; Electronic equipment; Employee welfare; Environmentally friendly manufacturing techniques; Manuals; Printed circuits; Recycling; Robotic assembly; Robotics and automation; Service robots;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics and the Environment, 2008. ISEE 2008. IEEE International Symposium on
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    978-1-4244-2272-2
  • Electronic_ISBN
    978-1-4244-2298-2
  • Type

    conf

  • DOI
    10.1109/ISEE.2008.4562862
  • Filename
    4562862