Title :
Modelling effects of packaging on pull-in behaviour of doubly-anchored beams
Author :
Lishchynska, Maryna ; O´Mahony, Conor ; Slattery, Orla ; Wittier, O.
Author_Institution :
Tyndall Nat. Inst., Cork
Abstract :
Understanding the influence of the packaging process on MEMS device performance is critical for a successful design and analysis of both the device and the package. This paper is concerned with accurate prediction of the effects of packaging processes on the pull-in behaviour of doubly anchored microbeams. Results of parametric studies on the effect of gluing (die attach) on the pull-in behaviour of beams of various lengths, widths, anchor types, adhesives and adhesive thicknesses are presented. Where experimental data were available, a good correlation between measured and simulated results was achieved
Keywords :
adhesive bonding; beams (structures); microassembling; micromechanical devices; semiconductor device packaging; MEMS device; adhesive thickness; die attach; doubly anchored microbeams; packaging process; Capacitive sensors; Curing; Electrostatics; Microassembly; Microelectromechanical devices; Microswitches; Packaging; Sensor phenomena and characterization; Temperature dependence; Voltage;
Conference_Titel :
Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006. 7th International Conference on
Conference_Location :
Como
Print_ISBN :
1-4244-0275-1
DOI :
10.1109/ESIME.2006.1643946
