SOI Die Heat Transfer Analysis from Device to Assembly Package

Author

Irving, Scott ; Liu, Yong ; Connerny, Duane ; Luk, Timwah

Author_Institution

Fairchild Semicond. Corp., South Portland, ME

fYear

2006

fDate

24-26 April 2006

Firstpage

1

Lastpage

6

Abstract

The operational characteristics of silicon devices are strongly influenced by device temperature. For SOI devices power dissipation is a much more significant challenge than for non-SOI devices. As a result the thermal design of SOI devices is vital to proper product performance. To maximize the engineering understanding of SOI circuits we develop a method to examine the combined system of SOI device and the package by finite element analysis. These results are compared to results obtained from an equivalent electrical model. The use of on die structures as an aide to heat dissipation is explored

Keywords

cooling; finite element analysis; integrated circuit design; integrated circuit modelling; integrated circuit packaging; silicon-on-insulator; SOI circuits; SOI devices; SOI die heat transfer analysis; assembly package; device temperature; finite element analysis; heat dissipation; silicon devices; silicon-on-insulator; thermal design; Assembly; Computational fluid dynamics; Digital audio players; Heat transfer; Integrated circuit packaging; MOSFETs; Semiconductor device packaging; Substrates; Temperature sensors; Wires;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006. 7th International Conference on

Conference_Location

Como

Print_ISBN

1-4244-0275-1

Type

conf

DOI

10.1109/ESIME.2006.1643947

Filename

1643947