• DocumentCode
    2114311
  • Title

    Selective E. coli trapping with 3D insulator-based dielectrophoresis using DC-biased, AC electric fields

  • Author

    Zellner, P.A. ; Sahari, A. ; Hosseini, Y. ; Behkam, B. ; Agah, Masoud

  • Author_Institution
    VT MEMS Lab., Virginia Tech, Blacksburg, VA, USA
  • fYear
    2012
  • fDate
    Aug. 28 2012-Sept. 1 2012
  • Firstpage
    6285
  • Lastpage
    6288
  • Abstract
    We present the development of a batch trapping, insulator-based dielectrophoretic (iDEP) device with three-dimensional design. The microfluidic devices use DC-biased, AC electric fields to selectively manipulate biological particles based on their electric properties. The mold for the polymer microdevices is fabricated using an RIE-lag technique which creates microchannels with varying depths using a single etch process. The resulting three-dimensional insulating constrictions permit operation at low applied voltages. By varying both the applied frequency and the ratio of AC to DC electric fields, the iDEP device can trap and separate polystyrene beads and E. coli cells.
  • Keywords
    bioMEMS; bioelectric phenomena; cellular biophysics; electrophoresis; etching; microchannel flow; microorganisms; polymers; AC electric field; DC-biased electric field; E. coli cell; RIE-lag technique; batch trapping; biological particle; insulator-based dielectrophoretic device; microchannel; microfluidic device; polymer microdevice; polystyrene bead; selective E. coli trapping; single etch process; three dimensional insulator-based dielectrophoresis; three-dimensional insulating constriction; Charge carrier processes; Dielectrophoresis; Electric fields; Fabrication; Fluid flow; Force; Silicon; dielectrophoresis; particle separation; three dimensional fabrication; Electricity; Electrophoresis; Escherichia coli; Microfluidics; Microscopy, Electron, Scanning;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society (EMBC), 2012 Annual International Conference of the IEEE
  • Conference_Location
    San Diego, CA
  • ISSN
    1557-170X
  • Print_ISBN
    978-1-4244-4119-8
  • Electronic_ISBN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/EMBC.2012.6347431
  • Filename
    6347431