• DocumentCode
    2114386
  • Title

    An Analysis of Beam Deflections in Poly-SiGe Cantilevers

  • Author

    Gonzalez, Mario ; Van Barel, Gregory ; Witvrouw, Ann ; Vandevelde, Bart

  • Author_Institution
    IMEC, Leuven
  • fYear
    2006
  • fDate
    24-26 April 2006
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    A predictive model for the deflection and profile of poly-SiGe beams for different thicknesses and geometries was evaluated. This model combines experimental data and finite element analysis (FEA). The structure employed to derivate the stress gradient and to calibrate and test the FEA calculations is a cantilever beam with dimensions of 1 mm length, 100 mum width and 10 mum thickness. The stress gradient of the film is obtained by measuring the deflection of the cantilevers with different etch depths. The deflection of the beam was calculated initially using a 2D plane stress model. The influence of the clamping region on the deflection was studied by using a perfect clamped beam and compared with a beam clamped only at the bottom clamp interface. In the second case a "tilt" effect near the anchor was observed due to the average stress in the unreleased thin film. FEM has been successfully applied to calculate the deflection of SiGe cantilever beams. Extra information like the stress distribution after releasing, the effect of Poisson\´s ratio on the curvature of the beam and the effect of clamping on the deflection was investigated
  • Keywords
    Ge-Si alloys; beams (structures); cantilevers; finite element analysis; stress analysis; thin films; 1 mm; 100 micron; 2D plane stress model; FEA; Poisson ratio; SiGe; beam deflection; cantilever beam; clamped beam; clamping region; finite element analysis; poly-SiGe; stress gradient; stress profile; tilt effect; Clamps; Etching; Finite element methods; Geometry; Predictive models; Silicon germanium; Stress measurement; Structural beams; Testing; Transistors; Cantilevers; Finite Element Modeling; Poly-SiGe; Stress gradient; Stress profile;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006. 7th International Conference on
  • Conference_Location
    Como
  • Print_ISBN
    1-4244-0275-1
  • Type

    conf

  • DOI
    10.1109/ESIME.2006.1643974
  • Filename
    1643974