• DocumentCode
    2114441
  • Title

    Assembly-Induced Stress and Its Effect on the Integrity of Assembly System in Drop Simulation

  • Author

    Ren, Wei ; Wang, Jianjun

  • Author_Institution
    Nokia, Irving, TX
  • fYear
    2006
  • fDate
    24-26 April 2006
  • Firstpage
    1
  • Lastpage
    7
  • Abstract
    In this paper, a drop vehicle of LCD system was selected to address the assembly-induced stress and its effect on the integrity of assembly system in drop simulation. A finite element procedure was implemented to analyze a two-step loaded LCD system in terms of ABAQUS/Standard and ABAQUS/Explicit tools. Firstly, the LCD is statically loaded by the pretension of the screws and the pressure of the elastomer to determine the stress/strain equilibrium by using the ABAQUS/Standard tool. Secondly, the pre-stressed LCD system is loaded by dropping it from one and half meters high onto a hard floor to assess its reliability under impact loading by means of the ABAQUS/Explicit tool. From the finite element analysis, it is found that the maximum stress level obtained from a model without assembly-induced pre-stressing is generally smaller than that obtained from a model with assembly-induced pre-stressing. In addition, the effect of the ratio of the pressed thickness of the elastomer to the non-pressed thickness of the elastomer on the LCD reliability was investigated based on the proposed procedure. An optimized ratio was recommended
  • Keywords
    assembling; elastomers; finite element analysis; impact testing; liquid crystal displays; reliability; stress-strain relations; ABAQUS-Explicit tool; ABAQUS-Standard tool; LCD reliability; assembly-induced stress; drop simulation; drop vehicle; elastomer; finite element analysis; impact loading; stress-strain equilibrium; Acceleration; Assembly systems; Batteries; Capacitive sensors; Electric shock; Fasteners; Finite element methods; Packaging; Residual stresses; Vehicles;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006. 7th International Conference on
  • Conference_Location
    Como
  • Print_ISBN
    1-4244-0275-1
  • Type

    conf

  • DOI
    10.1109/ESIME.2006.1643977
  • Filename
    1643977