DocumentCode :
2114740
Title :
Moisture absorption phenomena in green composite printed circuit board prototypes
Author :
Lincoln, John D. ; Shapiro, Andrew A. ; Saphores, Jean-Daniel M. ; Ogunseitan, Oladele A.
Author_Institution :
Dept. of Chem. Eng. & Mater. Sci., Univ. of California, Irvine, CA
fYear :
2008
fDate :
19-22 May 2008
Firstpage :
1
Lastpage :
6
Abstract :
This research developed the moisture-resistance of printed circuit board (PCB) laminate prototypes based on the non-toxic composite materials made from epoxidized linseed oil, melamine polyphosphate, and flax fibers. One of the key issues associated with using renewable base materials in composites is their sensitivity to moisture. A characterization of the properties of the dasiagreenpsila printed circuit boards developed in the present study showed that moisture absorption for untreated fiber laminates (4.87% vs. established limit Lt0.8% for FR4 boards over a 24 hour submersion period) compromised electrical resistance and decreased dielectric breakdown to an unacceptable level. A theoretical model was used to target methods for reducing moisture absorption. Based on this model, we found that reductions in fiber diffusivity and fiber volume fraction substantially reduce composite diffusivity. Through the use of chemical treatment, moisture absorption over a 24 hour time period was reduced from 4.87% to 1.15%, which improved electrical properties. At the end of this study, 15 of 18 PCB property requirements were met, while 3 moisture-critical property targets were narrowly missed.
Keywords :
composite materials; electric breakdown; environmental factors; moisture; printed circuits; PCB; dielectric breakdown; epoxidized linseed oil; flax fibers; green composite printed circuit board prototypes; melamine polyphosphate; moisture absorption; moisture absorption phenomena; moisture-critical property; nontoxic composite materials; printed circuit board; renewable base materials; Absorption; Chemicals; Composite materials; Dielectric breakdown; Electric resistance; Laminates; Moisture; Petroleum; Printed circuits; Prototypes; Design for Environment; Green Composite; Moisture Absorption; Natural Fiber; Printed Circuit Board;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics and the Environment, 2008. ISEE 2008. IEEE International Symposium on
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4244-2272-2
Electronic_ISBN :
978-1-4244-2298-2
Type :
conf
DOI :
10.1109/ISEE.2008.4562925
Filename :
4562925
Link To Document :
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