DocumentCode :
2114961
Title :
Using FMEA and FAHP to risk evaluation of green components
Author :
Hsu, Chia-Wei ; Hu, Allen H. ; Wu, Wei-Cheng
Author_Institution :
Inst. of Eng. Technol., Nat. Taipei Univ. of Technol., Taipei
fYear :
2008
fDate :
19-22 May 2008
Firstpage :
1
Lastpage :
6
Abstract :
This study utilized the failure modes and effects analysis (FMEA) to analyze the risks of components in compliance with the EU RoHS directive in the incoming quality control (IQC) stage, which is based on a case of an electronic manufacturer in Taiwan. There are three indices of FMEA in this work: the occurrence (O) that can be learned from the testing report; the likelihood of being detected (D) that refers to the difficulty of detection; and severity (S) that can be quantified from the declaration statement (S1) and the frequency of green component used by project (S2). The fuzzy analytic hierarchy process (FAHP) was applied to determine the relative weightings of four factors, then a green component risk priority number (GC-RPN) can be calculated for each one of the components, which are provided by the suppliers to identify and manage the risks that may be derived from them. Numerical results indicated that through the use of the proposed approach, the detected rate of the high risk green components can at least be improved to 20%.
Keywords :
electronics industry; environmental factors; failure analysis; fuzzy set theory; numerical analysis; quality control; risk management; electronic manufacturer; failure modes and effects analysis; fuzzy analytic hierarchy process; green component risk priority number; incoming quality control; risk evaluation; Chemical hazards; Failure analysis; Green products; Legislation; Manufacturing; Procurement; Quality control; Risk analysis; Risk management; Supply chains; FAHP; FMEA; Green component; Hazardous substance; Risk evaluation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics and the Environment, 2008. ISEE 2008. IEEE International Symposium on
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4244-2272-2
Electronic_ISBN :
978-1-4244-2298-2
Type :
conf
DOI :
10.1109/ISEE.2008.4562937
Filename :
4562937
Link To Document :
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