Lead-Free Solder Cyclic Plasticity Characterization for Drop Test Simulations

Author

Bonnaud, E.L. ; Gudmundson, P.

Author_Institution

Infineon Technol. Sweden AB, Stockholm

fYear

2006

fDate

24-26 April 2006

Firstpage

1

Lastpage

4

Abstract

Mechanical behaviour of lead-free solder has been investigated experimentally and thereafter modelled analytically. Material test specimens subjected to uniaxial cyclic loadings at different strain rates exhibit noticeable properties: viscoplasticity, nonlinear mixed hardening within each cycle and hardening followed by softening between consecutive cycles. To accurately describe these behaviours, a modified Armstrong and Fredrick model was combined to the Perzyna viscoplastic evolution equation. The set of parameters was determined by both curve-fitting and use of analytical relations

Keywords

impact testing; solders; viscoplasticity; work hardening; Perzyna viscoplastic evolution equation; cyclic plasticity characterization; drop test simulation; lead-free solder; nonlinear mixed hardening; strain rates; uniaxial cyclic loadings; viscoplasticity; Capacitive sensors; Curve fitting; Electronic equipment testing; Environmentally friendly manufacturing techniques; Lead; Materials reliability; Materials testing; Microstructure; Stress; Uniaxial strain;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006. 7th International Conference on

Conference_Location

Como

Print_ISBN

1-4244-0275-1

Type

conf

DOI

10.1109/ESIME.2006.1644023

Filename

1644023