DocumentCode :
2115798
Title :
Electromechanical Model of a Multi-Layer Piezoelectric Cantilever
Author :
Brufau-Penella, J. ; Puig-Vidal, M.
Author_Institution :
Instrum. & Commun. Syst. Lab., Univ. de Barcelona
fYear :
2006
fDate :
24-26 April 2006
Firstpage :
1
Lastpage :
7
Abstract :
In this paper the constituent equations that describe the behavior of a multi-layer piezoelectric cantilever on the coupled electronic and mechanical domain are presented. The study is based on the modal analysis of the partial differential equations governing the motion of an Euler-Bernoulli cantilever beam and on a pair of linearly coupled piezoelectric equations. An important element in the modelization of such materials is the energy loss term; in this paper a viscous damping contribution is considered which allows us to extract more realistic constituent equations for the material to work as sensor and actuator. The development of this equation as an infinite linear combination of each mode allows us to extract a compact lumped equivalent electrical circuit to work at any frequency region as sensor or actuator instead of the classical reduced models. Theory is reduced to study the dynamics of a triple-layer commercial cantilever and then is compared with experimental results
Keywords :
beams (structures); cantilevers; equivalent circuits; lumped parameter networks; partial differential equations; piezoelectric materials; piezoelectricity; Euler-Bernoulli cantilever beam; compact equivalent electrical circuit; coupled electronic domain; electromechanical model; infinite linear combination; lumped equivalent electrical circuit; mechanical domain; modal analysis; multilayer piezoelectric cantilever; partial differential equations; triple-layer commercial cantilever; viscous damping contribution; Actuators; Circuits; Damping; Differential equations; Energy loss; Modal analysis; Motion analysis; Optical coupling; Partial differential equations; Structural beams;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006. 7th International Conference on
Conference_Location :
Como
Print_ISBN :
1-4244-0275-1
Type :
conf
DOI :
10.1109/ESIME.2006.1644024
Filename :
1644024
Link To Document :
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