• DocumentCode
    2115935
  • Title

    Assessing micromechanical sensor characteristics via optical and electrical metrology

  • Author

    Langfelder, G. ; Tocchio, A. ; Thompson, M.J. ; Jaramillo, G. ; Horsley, D.A.

  • Author_Institution
    Electron. & Inf. Technol. Dept., Politec. di Milano, Milan, Italy
  • fYear
    2010
  • fDate
    1-4 Nov. 2010
  • Firstpage
    1765
  • Lastpage
    1769
  • Abstract
    This paper presents a custom instrument for the static and dynamic electrical characterization of capacitive MEMS sensors. Such a tool is useful for the validation of Finite Element Models (FEM) of MEMS prior to device operation, for the estimation of process parameters and consequent variance in the device performance, and for endurance tests. The core of the instrument consists of the capacitive sensing electronics, which in this work features a novel demodulation scheme, based on active Schottky diodes rectifying. As an example, a complete electro-mechanical characterization of a micro-machined charge sensor is performed for three different packaging conditions. A data reduction procedure is used to estimate the mechanical device parameters (flexure stiffness, natural frequency, and quality factor) and unknown process parameters like the over etching. The results are cross-validated using stroboscopic image captures, obtained through a Planar Motion Analyzer and then compared to FEM simulations.
  • Keywords
    Schottky diodes; capacitive sensors; finite element analysis; micromechanical devices; microsensors; FEM simulation; MEMS sensor; Schottky diode rectifying; capacitive sensing electronics; data reduction procedure; demodulation scheme; electrical metrology; endurance test; finite element model; micromachined charge sensor; micromechanical sensor characteristics; optical metrology; planar motion analyzer; sensor electromechanical characterization; stroboscopic image capture;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Sensors, 2010 IEEE
  • Conference_Location
    Kona, HI
  • ISSN
    1930-0395
  • Print_ISBN
    978-1-4244-8170-5
  • Electronic_ISBN
    1930-0395
  • Type

    conf

  • DOI
    10.1109/ICSENS.2010.5689961
  • Filename
    5689961