DocumentCode
2116121
Title
Fatigue and Thermal Fatigue Damage Analysis of Thin Metal Films
Author
Zhang, G.P. ; Volkert, C.A. ; Schwaiger, R. ; Mönig, R. ; Kraft, O.
Author_Institution
Inst. of Metal Res., Chinese Acad. of Sci., Shenyang
fYear
2006
fDate
24-26 April 2006
Firstpage
1
Lastpage
6
Abstract
In this paper, we summarize several testing methods that are currently available for the characterization of fatigue properties of thin metal films. Using these testing methods, a number of experimental investigations of the fatigue and thermal fatigue of metal films with thicknesses ranging from micrometers to sub-micrometers are described. Extensive experimental observations as well as theoretical analyses reveal that the damage behavior, i.e. typical fatigue extrusions and cracking, are quite different from that of bulk materials, and are controlled by the length scales of the materials. Due to the high surface to volume ratio of thin films interface-induced and diffusion-related damage are prevalent in these small length scale materials. As a result, interfaces pose a serious threat to the reliability of thin films
Keywords
metallic thin films; micromechanical devices; micrometry; reliability; thermal stress cracking; damage behavior; fatigue properties; interfaces pose; micrometers; thermal fatigue damage analysis; thin film reliability; thin metal films; typical fatigue cracking; typical fatigue extrusions; Electromagnetic measurements; Fabrication; Fatigue; Materials science and technology; Materials testing; Piezoelectric films; Substrates; Temperature; Thermal expansion; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006. 7th International Conference on
Conference_Location
Como
Print_ISBN
1-4244-0275-1
Type
conf
DOI
10.1109/ESIME.2006.1644037
Filename
1644037
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