DocumentCode :
2116318
Title :
Extraction of material parameters for creep experiments on real solder-joints by FE analysis
Author :
Röllig, Mike ; Wiese, Steffen ; Wolter, Klaus-Jürgen
Author_Institution :
IAVT, Dresden Univ. of Technol.
fYear :
2006
fDate :
24-26 April 2006
Firstpage :
1
Lastpage :
9
Abstract :
A modern approach to determine material data of solder alloys such as SnAg and SnAgCu is to measure the mechanical behaviour direct on a CSP/BGA solder connection. Advantages of that technique of measurement on industrial manufactured solder bumps are the considerations of miniaturized volumes and the material diffusion from connection pad into the alloy during reflow soldering process. Compared to the tensile test the shear experiment differs in the way of initiation the force load into the solder alloy. The shear force load inducts a multiaxial state of stress. This is the reason for the confrontation with a higher effort into the conversion procedure to determine specific coefficients for the material law. In several publications creep data were published based on shear force load measurements and applied cylinder model to convert primary data into equivalent values. In practice, the specimen bumps may have been different in their shape, depending on pad geometry, solder volume and weight of electronic component. How does the shape of solder joints influence the creep behaviour? A form parameter has been introduced to be able to describe a wide range of solder bump shapes. Every bump shape from barrel to hyperbolic can now be regarded. The form parameter also takes place in the conversion of experimental data into equivalent data. The determined creep material laws, based on the improved analytic model, describe the deformation behaviour of solder joints more accurately, than the commonly assigned creep laws using the pure cylinder model. The shape effect is shown on a FEM analysis of the experimental setup of creep measurements on shape varied Sn96.5Ag3.5 solder bumps. In general, during FEM based material modelling the coefficients of the material laws need to be stepwise changed until the right behaviour occurs. These iterations can stretch over a long time. The improved analytical model shows the potential to shorten the coefficient determination of material - - laws
Keywords :
ball grid arrays; chip scale packaging; copper alloys; creep testing; finite element analysis; reflow soldering; silver alloys; solders; tin alloys; CSP/BGA solder connection; SnAgCu; creep experiments; creep material laws; deformation behaviour; finite element analysis; material parameter extraction; real solder-joints; reflow soldering; shear force load measurements; solder alloys; solder bumps; tensile test; Creep; Data mining; Deformable models; Force measurement; Iron; Manufacturing industries; Mechanical variables measurement; Shape measurement; Soldering; Volume measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006. 7th International Conference on
Conference_Location :
Como
Print_ISBN :
1-4244-0275-1
Type :
conf
DOI :
10.1109/ESIME.2006.1644044
Filename :
1644044
Link To Document :
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