Title :
Thermo-Mechanical Analysis of the Packaging Process for Micro-Electronic Displays
Author :
Lee, Yek Bing ; Bailey, Chris ; Lu, Hua ; Riches, Steve ; Bartholomew, Martin ; Tebbit, Nigel
Author_Institution :
Greenwich Univ., London
Abstract :
Micro-electronic displays are sensitive devices and its performance is easily affected by external environmental factors. To enable the display to perform in extreme conditions, the device must be structurally strengthened, the effects of this packaging process was investigated. A thermo-mechanical finite element analysis was used to discover potential problems in the packaging process and to improve the overall design of the device. The main concern from the analysis predicted that displacement of the borosilicate glass and the Y stress of the adhesive are important. Using this information a design which reduced the variation of displacement and kept the stress to a minimum was suggested
Keywords :
adhesives; finite element analysis; integrated circuit packaging; liquid crystal displays; manufacturing processes; thermomechanical treatment; adhesive stress; finite element analysis; microelectronic displays; packaging process; thermomechanical analysis; Active matrix liquid crystal displays; Aerospace industry; Capacitive sensors; Finite element methods; Glass; Liquid crystal displays; Packaging; Temperature; Thermal stresses; Thermomechanical processes;
Conference_Titel :
Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006. 7th International Conference on
Conference_Location :
Como
Print_ISBN :
1-4244-0275-1
DOI :
10.1109/ESIME.2006.1644051
