• DocumentCode
    2116732
  • Title

    Sensor architectural tradeoff for diabetic foot ulcer monitoring

  • Author

    Ostadabbas, S. ; Saeed, Ahmed ; Nourani, M. ; Pompeo, M.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Texas at Dallas, Richardson, TX, USA
  • fYear
    2012
  • fDate
    Aug. 28 2012-Sept. 1 2012
  • Firstpage
    6687
  • Lastpage
    6690
  • Abstract
    The diabetic foot complications constitute a tremendous challenge for patients, caregivers, and the healthcare system. Studies show up to 25% of diabetic individuals will develop a foot ulcer during their lifetime and many of these patients eventually must undergo amputation as a result of infection due to untreated foot ulcers. With current technology, in-shoe monitoring systems can be implemented to continuously monitor at-risk ulceration sites based on known indicators such as peak pressure. The important parameters in designing a pressure-sensing insole include the number, location and size of sensors. In this paper, we aim at showing the criticality of sensor architectural tradeoff in developing the in-shoe plantar pressure monitoring systems. We evaluate this tradeoff by using our custom-made platform for data collection during normal walking.
  • Keywords
    diseases; footwear; patient monitoring; pressure sensors; amputation; caregivers; diabetic foot ulcer monitoring; healthcare system; in-shoe monitoring system; normal walking; patients; pressure sensing insole; sensor architectural tradeoff; Diabetes; Foot; Footwear; Force; Monitoring; Pressure measurement; Wounds; Adolescent; Adult; Biomechanical Phenomena; Diabetic Foot; Equipment Design; Female; Foot; Foot Ulcer; Gait; Humans; Male; Middle Aged; Monitoring, Ambulatory; Pressure; Risk; Shoes; Transducers; Walking; Young Adult;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society (EMBC), 2012 Annual International Conference of the IEEE
  • Conference_Location
    San Diego, CA
  • ISSN
    1557-170X
  • Print_ISBN
    978-1-4244-4119-8
  • Electronic_ISBN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/EMBC.2012.6347528
  • Filename
    6347528