Title :
Reliability of MEMS
Author_Institution :
IMECvzw, Leuven
Abstract :
This paper discusses the reliability of MEMS. Issues such as the definition of reliability, failure driven qualification methodology and failure mode effect analysis (FMEA) are described. It is shown that reliability should be looked at from a much wider perspective, including design, processing and packaging issues and taking into account environmental effects. Examples are given for the case of capacitive RF-MEMS
Keywords :
failure analysis; micromechanical devices; reliability; FMEA; MEMS reliability; capacitive RF-MEMS; environmental effects; failure driven qualification methodology; failure mode effect analysis; Failure analysis; IEC standards; Materials reliability; Micromechanical devices; Packaging; Probability; Process design; Radiofrequency microelectromechanical systems; Testing; Thermomechanical processes;
Conference_Titel :
Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006. 7th International Conference on
Conference_Location :
Como
Print_ISBN :
1-4244-0275-1
DOI :
10.1109/ESIME.2006.1644069
