Thermal Performance and Reliability of Thermal Interface Materials: A Review

Author

Rodgers, Peter ; Eveloy, Valérie ; Rahim, Emil ; Morgan, David

Author_Institution

Pet. Inst., Abu Dhabi

fYear

2006

fDate

24-26 April 2006

Firstpage

1

Lastpage

2

Abstract

This paper presents a survey of the thermal performance of a range of TIMs (adhesives, greases, phase change materials (PCMs) and thermal pads) from different vendors. Previously published studies on TIM thermal performance characterization and reliability assessment for electronics packaging are reviewed. The potential limitations of ASTM D 5470 standard, and TIM industry thermal impedance characterization practices utilizing this standard are discussed, as well as alternative characterization approaches. From this analysis, guidelines are derived on TIM selection from thermal performance and reliability perspectives

Keywords

adhesives; electronics packaging; phase change materials; reliability; thermal resistance measurement; PCM; TIM; adhesives; electronics packaging; greases; phase change materials; reliability assessment; thermal impedance characterization; thermal interface materials; thermal pads; thermal performance; Conducting materials; Electronic packaging thermal management; Materials reliability; Microassembly; Phase change materials; Thermal conductivity; Thermal engineering; Thermal management; Thermal management of electronics; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006. 7th International Conference on

Conference_Location

Como

Print_ISBN

1-4244-0275-1

Type

conf

DOI

10.1109/ESIME.2006.1644070

Filename

1644070