Title :
Thinfilm Multilayer Technology for Microwave Applications
Author :
Ferling, D. ; Richter, H.
Author_Institution :
Alcatel SEL Research Centre, Dep. Microsystems ZFZ/WM, Lorenzstr. 10, D-70435 Stuttgart, Germany, Phone: +49 711 821 4159, Fax: +49 711 821 4911
Abstract :
Cost reduction and increase of performance and packaging density are the main goals for development of new RF-systems. These goals can be achieved by use of thinfilm multilayer (TFML) technology suitable for applications at microwave frequencies. Within this work TFML test vehicles realized with different dielectric materials are described. The compatibility with advanced chip connection technologies is demonstrated. RF-measurements up to 40 GHz were done to characterise the technology, to evaluate the RF-behaviour of passive microwave components and to investigate the transmission behaviour of high bitrate signals. The experimental results are presented and discussed. An-outlook for applications of the technology is given.
Keywords :
Adhesives; Dielectric materials; Dielectric substrates; Impedance; Microwave frequencies; Microwave technology; Nonhomogeneous media; Polymers; Rough surfaces; Surface roughness;
Conference_Titel :
Microwave Conference, 1994. 24th European
Conference_Location :
Cannes, France
DOI :
10.1109/EUMA.1994.337236
