A design technique for MM-wave digital signal equalizing amplifier modules

This paper describes a design tehnique for wide-band amplifier modules that operate from dc to millimeter wave frequencies. In the design, finite-difference time-domain electromagnetic simulations are employed to analyze the electrical performance of the package structure as well as to verify the IC and module performance. Based on this design, two types of modules, a single-chip and a multi-chip module, were fabricated. The single-chip module has a gain of about 9 dB from dc to 58GHz and the multi-chip module operates at a 17.5-dB gain from 60 kHz to 48 GHz.