Title :
On-board data compression using a 3d packaging dsp module -experiences and issues
Author_Institution :
Institut d´´Astrophysique Spatiale
Keywords :
Data compression; Data processing; Digital signal processing; Digital signal processors; Earth; Instruments; Mars; Packaging; Space missions; Space technology;
Conference_Titel :
Aerospace Conference, 2003. Proceedings. 2003 IEEE
Print_ISBN :
0-7803-7651-X
DOI :
10.1109/AERO.2003.1235156
