DocumentCode
2119342
Title
On-board data compression using a 3d packaging dsp module -experiences and issues
Author
Eng, Pascal
Author_Institution
Institut d´´Astrophysique Spatiale
Volume
5
fYear
2003
fDate
March 8-15, 2003
Keywords
Data compression; Data processing; Digital signal processing; Digital signal processors; Earth; Instruments; Mars; Packaging; Space missions; Space technology;
fLanguage
English
Publisher
ieee
Conference_Titel
Aerospace Conference, 2003. Proceedings. 2003 IEEE
ISSN
1095-323X
Print_ISBN
0-7803-7651-X
Type
conf
DOI
10.1109/AERO.2003.1235156
Filename
1235156
Link To Document