DocumentCode
2119842
Title
New technologies for board level interconnect
Author
Bjomdahl, W.D. ; Berenz, John
Author_Institution
Northrop Grumman Space Technology
Volume
6
fYear
2003
fDate
March 8-15, 2003
Keywords
Aging; Assembly; Bonding; Connectors; Dielectric losses; Electronics packaging; Integrated circuit interconnections; Optical interconnections; Printed circuits; Space technology;
fLanguage
English
Publisher
ieee
Conference_Titel
Aerospace Conference, 2003. Proceedings. 2003 IEEE
ISSN
1095-323X
Print_ISBN
0-7803-7651-X
Type
conf
DOI
10.1109/AERO.2003.1235176
Filename
1235176
Link To Document