DocumentCode :
2119842
Title :
New technologies for board level interconnect
Author :
Bjomdahl, W.D. ; Berenz, John
Author_Institution :
Northrop Grumman Space Technology
Volume :
6
fYear :
2003
fDate :
March 8-15, 2003
Keywords :
Aging; Assembly; Bonding; Connectors; Dielectric losses; Electronics packaging; Integrated circuit interconnections; Optical interconnections; Printed circuits; Space technology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Aerospace Conference, 2003. Proceedings. 2003 IEEE
ISSN :
1095-323X
Print_ISBN :
0-7803-7651-X
Type :
conf
DOI :
10.1109/AERO.2003.1235176
Filename :
1235176
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2119842
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