Title : 
Reliability of class 2 heel fillets on gull wing leaded components
         
        
            Author : 
Estes, Thomas ; Wong, Wing ; McMullen, William ; Berger, Timothy ; Saito, Yoshio
         
        
            Author_Institution : 
Northrop Grumman Space Technology
         
        
        
        
        
            Keywords : 
Aerospace electronics; Assembly; Bonding; Electronic packaging thermal management; Electronics packaging; Lead; Soldering; Space technology; Testing; Thermal stresses;
         
        
        
        
            Conference_Titel : 
Aerospace Conference, 2003. Proceedings. 2003 IEEE
         
        
        
            Print_ISBN : 
0-7803-7651-X
         
        
        
            DOI : 
10.1109/AERO.2003.1235177