Title :
Reliability of class 2 heel fillets on gull wing leaded components
Author :
Estes, Thomas ; Wong, Wing ; McMullen, William ; Berger, Timothy ; Saito, Yoshio
Author_Institution :
Northrop Grumman Space Technology
Keywords :
Aerospace electronics; Assembly; Bonding; Electronic packaging thermal management; Electronics packaging; Lead; Soldering; Space technology; Testing; Thermal stresses;
Conference_Titel :
Aerospace Conference, 2003. Proceedings. 2003 IEEE
Print_ISBN :
0-7803-7651-X
DOI :
10.1109/AERO.2003.1235177