DocumentCode :
2120855
Title :
Modeling VLSI Interconnections For Cross-talk Simulation
Author :
Poltz, By J.
Author_Institution :
OptEM Engineering Inc.
fYear :
1993
fDate :
14-15 May 1993
Firstpage :
144
Lastpage :
145
Keywords :
Circuit simulation; Dielectric losses; Frequency; Inductance; Integrated circuit interconnections; Multiconductor transmission lines; SPICE; Transmission line discontinuities; Transmission line matrix methods; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Process and Device Modeling, 1993. (1993 VPAD) 1993 International Workshop on
Print_ISBN :
0-7803-1338-0
Type :
conf
DOI :
10.1109/VPAD.1993.724761
Filename :
724761
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2120855
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