• DocumentCode
    2120855
  • Title

    Modeling VLSI Interconnections For Cross-talk Simulation

  • Author

    Poltz, By J.

  • Author_Institution
    OptEM Engineering Inc.
  • fYear
    1993
  • fDate
    14-15 May 1993
  • Firstpage
    144
  • Lastpage
    145
  • Keywords
    Circuit simulation; Dielectric losses; Frequency; Inductance; Integrated circuit interconnections; Multiconductor transmission lines; SPICE; Transmission line discontinuities; Transmission line matrix methods; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Process and Device Modeling, 1993. (1993 VPAD) 1993 International Workshop on
  • Print_ISBN
    0-7803-1338-0
  • Type

    conf

  • DOI
    10.1109/VPAD.1993.724761
  • Filename
    724761
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2120855