DocumentCode :
2121484
Title :
Metal pillar interconnection topology for bonded two-terminal multijunction III–V solar cells
Author :
McMahon, William E. ; Lin, Chu-Ti ; Ward, J. Scott ; Geisz, John F. ; Wanlass, M.W. ; Carapella, J.J. ; Olavarria, W. ; Young, Michelle ; Steiner, Myles A. ; France, Ryan M. ; Kibbler, A.E. ; Duda, A. ; Olson, J.M. ; Perl, Emmett E. ; Friedman, Daniel J.
Author_Institution :
National Renewable Energy Laboratory, Golden, CO, USA
fYear :
2012
fDate :
3-8 June 2012
Firstpage :
1
Lastpage :
6
Abstract :
Metal-interconnected multijunction solar cells offer one pathway toward efficiencies in excess of 50%. However, if a 3- or 4-terminal configuration is used, optical losses from the interfacial grid can be considerable. Here, we examine an alternative which provides an optimal interconnection for two-terminal bonded devices. This “pillar-array” topology is optimized by minimizing the sum of all power losses, including shadow losses and numerically computed electrical losses. Numerical modeling is used to illustrate the benefit of a pillar-array interfacial metallization for some 2-terminal configurations.
Keywords :
Arrays; Bonding; Metallization; Optical losses; Photonic band gap; Topology; III–V semiconductor materials; bonding processes; optimization; photovoltaic cells; semiconductor device modeling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Photovoltaic Specialists Conference (PVSC), Volume 2, 2012 IEEE 38th
Conference_Location :
Austin, TX, USA
Type :
conf
DOI :
10.1109/PVSC-Vol2.2012.6656759
Filename :
6656759
Link To Document :
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